3M™ Electrically Conductive Adhesive Transfer Tapes

Help save time in a variety of specialized electronics assembly operations with 3M™ Electrically Conductive Adhesive Transfer Tapes. These long-lasting tapes can eliminate the need for screws and mechanical fasteners – while providing for contact grounding and EMI Shielding in the bond line gap/slit.

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Features and benefits:

Advanced adhesive and conductive properties in an easy-to-use, pressure-sensitive tape
Hand- or machine-apply and die-cut to virtually any shape
Unique construction and adhesion ensures powerful, sustained contact
No messy residues, unlike carbon-loaded, semi-liquid adhesives
Excellent handling characteristics from built-in conductive fibers
Low electrical resistance/good conductivity for increased shielding effectiveness

3M™ Electrically Conductive Adhesive Transfer Tapes (ECATT) XYZ-Axis (Isotropic) Conductivity

3M offers a variety of high-quality isotropic tapes for your most demanding electronics industry applications:

3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9712, 9709S, 9707 are part of a highly filled ECATT product line that provides for excellent grounding and also EMI Shielding in the bond line gap/slit.
3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9713, 9723, 9725 are part of a conductive non-woven family ECATT product line that provides for excellent grounding performance, ease of rework and a variety of adhesive types. The 3M ECATT 9719 is a Silicone based ECATT for low surface energy surfaces, such as silicone EMI Gasket attachment.
3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719 and 7772 is part of a double-coated foil tape ECATT product line. The products offer good grounding and along with the 9712 non-woven ECATT product, offer a mid-range grounding performance product.

3M™ Electrically Conductive Adhesive Transfer Tape Z-Axis (Anisotropic) Conductivity

This easy-to-use, pressure-sensitive tape was designed for connecting, bonding, and grounding flex circuits, PCBs and EMI/RFI shields and gaskets. Apply at room temperature – no thermal bonding required.

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Products
Product Documentation
Application Tips

3M ECATT General Overview Comparative Reference Table							Contact Resistance (R ohms) between a copper foil test panel and a 2nd sheet of a copper foil test panel using the 3M ECATT	Contact Resistance (R ohms) between a gold flexible test strip and a gold pad PCB panel using the 3M ECATT
Product	Pictorial Design	Thickness (µm)	Z or XYZ Conductivity (Based on 3M Test Method)	Conductive Filter Type	Adhesive Type	Features, Advantages, and Benefits	Copper foil bonded to a copper foil using the 3M ECATT / 3M 2-point resistance test method / 645mm2 Overlap Contact Area / 1 Hr RT Dwell. See note 1.	Gold flex bonded to PCB gold test pad. 6mm2 overlap contact area. 1 Hr RT Dwell. See note 1.
9703		50	Z	Silver	Low Outgassing Acrylic ECATT	Z-Axis, Low Outgassing	< 0.2	< 0.2
9705		50	Z	Silver	Standard Acrylic ECATT	Z-Axis, Standard outgassing version of 9703	< 0.2	< 0.2
9706		50	Z	Silver	High Adhesion Acrylic ECATT	High Adhesion version of the 9705	< 0.2	< 0.3
9707		50	XYZ	Silver	High Adhesion Acrylic ECATT	High Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency, Low contact R to SS	< 0.2	< 0.3
9709		50	XYZ	Silver	Standard Acrylic ECATT	Standard Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency	< 0.2	< 0.3
9709S		50	XYZ	Silver	Standard Acrylic ECATT	Standard Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency, Low contact R to SS	< 0.2	< 0.2
9709SL		50	XYZ	Silver	Standard Acrylic ECATT	Premium low liner release version of 9709S	< 0.2	< 0.2
7805		150	XYZ	Silver	Standard Acrylic ECATT	Thicker ECATT for gap filling.	< 1.0	< 0.2
7850		150	XYZ	Carbon	High Adhesion Acrylic ECATT	Higher Thermal Conductivity & Thicker ECATT for gap filling.	< 1.0	< 10.0
7772		66	XYZ	Nickle & Alum DC	Medium Adhesion Acrylic D/C	Double Coated Aluminum foil	< 0.5	< 2.0
9712		125	XYZ	Carbon	Standard Acrylic ECATT	Non-woven conductive scrim & Standard acrylic adhesive.	< 1.5	< 15.0
9713		89	XYZ	Nickel/C	Standard Acrylic ECATT	Lower R non-woven conductive scrim vs. 9712 & Standard acrylic adhesive.	< 0.4	< 7.5
9719		100	XYZ	Nickel/C	Silicone ECATT	Low surface energy silicone adhesive, Higher temperature resistance, Lower R non-woven conductive scrim vs. 9712.	< 1.0	< 20.0
9720		35	XYZ	Nickel/Cu	High Adhesion Acrylic ECATT	Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & Medium adhesion.	< 0.2	< 0.5
9723		60	XYZ	Nickel/Cu	High Adhesion Acrylic ECATT	Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & High adhesion.	< 0.2	< 0.4
9725		50	XYZ	Nickel/Cu	Medium Adhesion Acrylic ECATT	Lower R non-woven conductive scrim vs. 9713 & High adhesion.	< 0.2	< 0.5
9732		100	XYZ	Nickel/Cu	Medium Adhesion Acrylic ECATT	Lower R non-woven conductive scrim vs. 9713, Thicker scrim design & High adhesion.	< 0.2	< 2.5
9760		50	XYZ	Nickel/Cu	High / Low Adhesion Double sided reworkable Acrylic ECATT	Easier rework as greater Face Side to Back Side adhesion delta. Easier rework version of 9725. High and Low adhesion sides.	< 0.2	< 0.8
9764		150	XYZ	Nickel/Cu	High / Low Adhesion Double sided reworkable Acrylic ECATT	Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of the 9732. High and Low adhesion sides.	< 0.5	< 5.0
9780		200	XYZ	Nickel/Cu	High / Low Adhesion Double sided reworkable Acrylic ECATT	Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of the 9732. High and Low adhesion sides.	< 0.5	< 5.0
Note 1: Test & performance results will vary based on items such as, but are not limited to: Contact area, Assembly method, Testing conditions, Normal variations in product performance from one mfg. lot to a different mfg. lot of material-along with the normal variations found in a material within a mfg. lot (such as thickness, available conductive material in an actual sample tested, variations in conductive filler materials and uniformity of conductive materials dispersed within a lot of material, variations in adhesives, etc.), Test methods, Environmental aging, Exact test surface material type utilized, etc. The "Copper to Copper" & "Gold Flex to PC" testing also should be noted for the differences related to the "Contact area" difference in the Test Methods (645 mm2 vs. 6 mm2) as this does impact the test results. Testing of ECATT materials and the noted test substrates does not imply that the ECATT is suitable for an end use application of similar materials. End user is responsible to determine if an ECATT and substrate combination is fit for use in their intended end use application.
Note 2: For applications that will ground to surfaces with an oxide layer, such as SS, the lead suggested products to test would include: 3M ECATT 9709S, 9707, 9723, 9725, 9719. For additional suggestions, please contact the 3M ECATT Technical Service.