Skip to Primary Navigation Skip to Site Navigation Skip to Main Content All 3M.com Site Map
3M™ Tapes & Adhesives for Electrical Markets banner

3M™ Electrically Conductive Adhesive Transfer Tapes


3M™ Electrically Conductive Adhesive Transfer Tapes

Help save time in a variety of specialized electronics assembly operations with 3M™ Electrically Conductive Adhesive Transfer Tapes. These long-lasting tapes can eliminate the need for screws and mechanical fasteners – while providing for contact grounding and EMI Shielding in the bond line gap/slit.

  • Products
  • Product Documentation
  • Application Tips
3M ECATT General Overview Comparative Reference Table Contact Resistance (R ohms) between a copper foil test panel and a 2nd sheet of a copper foil test panel using the 3M ECATT Contact Resistance (R ohms) between a gold flexible test strip and a gold pad PCB panel using the 3M ECATT
Product Pictorial Design Thickness (µm) Z or XYZ Conductivity (Based on 3M Test Method) Conductive Filter Type Adhesive Type Features, Advantages, and Benefits Copper foil bonded to a copper foil using the 3M ECATT / 3M 2-point resistance test method / 645mm2 Overlap Contact Area / 1 Hr RT Dwell. See note 1. Gold flex bonded to PCB gold test pad. 6mm2 overlap contact area. 1 Hr RT Dwell. See note 1.
9703 9703 50 Z Silver Low Outgassing Acrylic ECATT Z-Axis, Low Outgassing < 0.2 < 0.2
9705 9705 50 Z Silver Standard Acrylic ECATT Z-Axis, Standard outgassing version of 9703 < 0.2 < 0.2
9706 9706 50 Z Silver High Adhesion Acrylic ECATT High Adhesion version of the 9705 < 0.2 < 0.3
9707 9707 50 XYZ Silver High Adhesion Acrylic ECATT High Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency, Low contact R to SS < 0.2 < 0.3
9709 9709 50 XYZ Silver Standard Acrylic ECATT Standard Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency < 0.2 < 0.3
9709S 9709S 50 XYZ Silver Standard Acrylic ECATT Standard Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency, Low contact R to SS < 0.2 < 0.2
9709SL 9709SL 50 XYZ Silver Standard Acrylic ECATT Premium low liner release version of 9709S < 0.2 < 0.2
7805 7805 150 XYZ Silver Standard Acrylic ECATT Thicker ECATT for gap filling. < 1.0 < 0.2
7850 7850 150 XYZ Carbon High Adhesion Acrylic ECATT Higher Thermal Conductivity & Thicker ECATT for gap filling. < 1.0 < 10.0
7772 7772 66 XYZ Nickle & Alum DC Medium Adhesion Acrylic D/C Double Coated Aluminum foil < 0.5 < 2.0
9712 9712 125 XYZ Carbon Standard Acrylic ECATT Non-woven conductive scrim & Standard acrylic adhesive. < 1.5 < 15.0
9713 9713 89 XYZ Nickel/C Standard Acrylic ECATT Lower R non-woven conductive scrim vs. 9712 & Standard acrylic adhesive. < 0.4 < 7.5
9719 9719 100 XYZ Nickel/C Silicone ECATT Low surface energy silicone adhesive, Higher temperature resistance, Lower R non-woven conductive scrim vs. 9712. < 1.0 < 20.0
9720 9720 35 XYZ Nickel/Cu High Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & Medium adhesion. < 0.2 < 0.5
9723 9723 60 XYZ Nickel/Cu High Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & High adhesion. < 0.2 < 0.4
9725 9725 50 XYZ Nickel/Cu Medium Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713 & High adhesion. < 0.2 < 0.5
9732 9732 100 XYZ Nickel/Cu Medium Adhesion Acrylic ECATT Lower R non-woven conductive scrim vs. 9713, Thicker scrim design & High adhesion. < 0.2 < 2.5
9760 9760 50 XYZ Nickel/Cu High / Low Adhesion Double sided reworkable Acrylic ECATT Easier rework as greater Face Side to Back Side adhesion delta. Easier rework version of 9725. High and Low adhesion sides. < 0.2 < 0.8
9764 9764 150 XYZ Nickel/Cu High / Low Adhesion Double sided reworkable Acrylic ECATT Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of the 9732. High and Low adhesion sides. < 0.5 < 5.0
9780 9780 200 XYZ Nickel/Cu High / Low Adhesion Double sided reworkable Acrylic ECATT Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of the 9732. High and Low adhesion sides. < 0.5 < 5.0
Note 1: Test & performance results will vary based on items such as, but are not limited to: Contact area, Assembly method, Testing conditions, Normal variations in product performance from one mfg. lot to a different mfg. lot of material-along with the normal variations found in a material within a mfg. lot (such as thickness, available conductive material in an actual sample tested, variations in conductive filler materials and uniformity of conductive materials dispersed within a lot of material, variations in adhesives, etc.), Test methods, Environmental aging, Exact test surface material type utilized, etc. The "Copper to Copper" & "Gold Flex to PC" testing also should be noted for the differences related to the "Contact area" difference in the Test Methods (645 mm2 vs. 6 mm2) as this does impact the test results. Testing of ECATT materials and the noted test substrates does not imply that the ECATT is suitable for an end use application of similar materials. End user is responsible to determine if an ECATT and substrate combination is fit for use in their intended end use application.
Note 2: For applications that will ground to surfaces with an oxide layer, such as SS, the lead suggested products to test would include: 3M ECATT 9709S, 9707, 9723, 9725, 9719. For additional suggestions, please contact the 3M ECATT Technical Service.