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Why use 3M ECM?

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Get to Market Faster, Facilitate Product
Innovation and Lower System Costs

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  1. Reduce design spins and thereby time to market by addressing PCB impedance, power bus noise and EMI issues earlier in the design cycle.

  2. Create better products by reducing PCB impedance, power bus noise, and EMI as well as increasing usable board area via simplifies PCB layouts.

  3. Lower total system costs by improving assembly yields, panel utilization, and reliability resulting from simplified PCB layouts.

Features and Functions of 3M ECM

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Features and Functions of 3M ECM

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  • Improves power integrity by reducing power bus noise and PCB impedance

  • Reduces EMI by decreasing resonance that causes EMI

  • Can improve signal integrity via improvements in power integrity and EMI

  • Dissipates heat much better than 2 mil FR-4 due to high thermal conductivity and low thermal impedance

  • Increases usable board area by allowing for the removal of many, if not all, capacitors equal to or below 0.1 µF and their associated solder joints and vias

  • Less sensitive to electrostatic discharge (ESD) than 2 mil FR-4

  • Allows for delivery of required charge even with small, split planes unlike 2 mil FR-4

Benefits of 3M ECM

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Time to Market

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  • Reduce design spins by solving noise issues early in the design cycle

  • Simplify board layout and routing
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Product Differentiation
  • Add functionality to existing boards

  • Reduce PCB size and weight

  • Add PCB layers while maintaining similar PCB thickness
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System Cost
  • Improve PCB panel utilization

  • Improve assembly yields and board reliability due to fewer components