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What is 3M ECM?


A High Performance Embedded Capacitance PCB Laminate

ECM Diagram

As discrete capacitor, optimally suited to:

  • Power supply decoupling
  • Low pass filtering
Halogen-free Options

  • A PCB laminate with high capacitive density that can be embedded into PCBs and chip packages for high speed digital and signal filter designs

  • Functions as either a power ground plane or a singulated, discrete capacitor where it performs especially well as a signal filter

  • Consists of very thin layer of ceramic-filled epoxy sandwiched between two layers of copper foil

  • Compatible with a large range of PCB material sets and with standard PCB fabrication and assembly processes, including lead-free

  • UL certified and RoHS compliant*

  • Halogen-free** versions available

  • 100% HiPOT testing available

  • Available in a variety of panel sizes and copper thicknesses

  • In production in telecom, computer, test and measurement, military/aerospace, medical, and consumer electronics applications

  • Available products range up to 10.0 nanofarads per square inch in capacitance density, making 3M ECM the highest capacitance density embedded capacitance material on the market

3M™ Embedded Capacitance Material Properties

Property Test Method C0614 C1011 (Preliminary)
Capacitance/Unit Area (1 kHz) Supplier Method 6.4 nF/in2 (1.0 nF/cm2) 10.0 nF/in2 (1.55 nF/cm2)
Dielectric Thickness Cross-section 14 µm (0.55 mils) 11 µm (0.43 mils)
Copper Type Supplier Method RA RA
Capacitance Tolerance Supplier Method +/- 10%
Dielectric Constant (1 kHz) Supplier Method 16 20
Dissipation Factor (1 kHz) Supplier Method 0.009 0.009
Temperature Coefficient of Capacitance (TCC) Supplier Method Meets X7R requirements
Dielectric Strength (Volts/Mil) ASTM D149 3300
HiPOT Insulation Resistance (Megaohm) IPC-TM-650 2.5.7.2 100 min. at 100V DC
Breakdown Voltage (Volts) IPC-TM-650 2.5.7.2 > 100
UL Flammability Rating UL 94 94 V-0
UL Relative Thermal Index UL 796 130°C
UL Solderability Limits UL 796 288°C/30 sec
Glass Transition Temperature Supplier Method (DSC) 120°C
Moisture Absorption (wt %) ASTM D570 0.11
CTE (ppm/C) Supplier Method 32 (x,y,z)
Degradation Temperature IPC-TM-650 2.3.40 360°C
Peel Strength (pli) IPC-TM-650 2.4.9 modified 3.0 > 5.0
Thermal Conductivity (W/m*K) ASTM E1530 0.39
Youngs Modulus (MPa) Supplier Method (DMA) 1377
Halogen Free Available** Supplier Method Yes Yes
All test data provided are typical values and not intended to be specification values.

* "RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing, this information represents 3M’s knowledge and belief based on information provided by third party suppliers to 3M.

** Halogen Free is defined as both 1) no halogen compounds that are intentionally added to the product or used in the manufacturing process for the product and 2) any impurities present are less than 900 ppm bromine, less than 900 ppm chlorine and/or less than 1500ppm total bromine and chlorine. The latter are the levels set forth in certain industry standards for printed circuit boards, such as the International Electrotechnical Commission (IEC) 61249-2-21 standard. This information represents 3M/s knowledge and belief which may be based in whole or in part on information provided by 3rd party suppliers to 3M.