Our next-generation abrasive technologies give you more production-proven ways to help meet today's most demanding CMP requirements. With pad conditioners for conventional slurry processes and unique SurryFree™ fixed abrasives, our products deliver superior planarization, a more stable process and low defect rates.
The proven, high performance alternative to conventional slurries, pads and conditioners lets you polish thousands of wafers between consumable changes.
Long-lasting 3M™ Diamond Pad Conditioners properly prepare the surface of the CMP pad. The advanced design of these next-generation conditioners gives you reliable 3M performance. Deliberate diamond placement produces a consistent finish, while superior diamond retention reduces wild scratching.
