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3M™ Fixed Abrasives for CMP



3M™ Abrasives for CMP

Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Fixed Abrasives for CMP deliver improved planarization without slurries. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protrusion to produce a consistent finish, while superior diamond retention reduces wild scratching.

Semiconductor CMP - Wafer Planarization

3M's innovative structured abrasive CMP product offers superior planarization and eliminates traditional slurries and pads in the chemical mechanical planarization of semiconductor wafers.

PDF3M™ Fixed Abrasive for Web-based Direct Polish STI Brochure PDF 362K

Key features and benefits:

  • Lower cost of ownership
  • Optimized for extended pad and disk life
  • Flat area of active diamonds for low non-uniformity
  • Exclusive polymer substrate enhances corrosion resistance
  • Diamonds secured with both chemical and mechanical bonds for superior retention